Manual DIP assembly for PCB
Manual DIP -PCB assembly is an important part of our JY company’s one-stop service. Almost all PCB designs have DIP assembly requirements. Today’s article will lead everyone to better understand the production process of DIP assembly.
What is dip assembly?
Dip assembly is a method of immersing the PCB board with inserted components in a melting tin furnace to complete many solder joints at one time.
In fact, dip assembly is mainly divided into manual dip soldering and machine dip soldering. What I want to introduce to you today is manual dip soldering.
What is manual dip assembly?
Manual dip assembly is a method in which a person holds a fixture to clamp the inserted PCB and manually completes the dip tin. The operation process is as follows:
- Heating to control the tin temperature in the tin furnace at 250-280℃;
- Apply a layer (or dip a layer) of flux on the PCB;
- Clamp the PCB with a clamp and immerse it in the tin furnace.so that the surface of the pad is in contact with the PCB board.
- The thickness of the immersion tin should be 1/2～2/3 of the thickness of the PCB. The immersion tin time is about 3～5 seconds;
- Make the PCB away from the tin surface at an angle of 5-10℃ betweenPCB board and tin surface. and check the soldering quality after cooling slightly. If there are many solder joints that are not well soldered, the immersion tin should be repeated once.
- For the board with only a few bad solder joints.manual repair welding can be used. Pay attention to frequently scrape off the tin slag on the surface of the tin furnace
- And maintain a good soldering state.so as not to affect the cleanliness and cleaning of the PCB due to the generation of tin slag.
The characteristics of manual dip assembly are as follow.
Simple equipment, low investment, but low efficiency and soldering quality are related to the skill of the operator. and there is a risk of missing the soldering. It is difficult to solder circuit boards with patches to get good results.
The most common problem we encounter in manual dip assembly.
These familiar PCBA friends all know that the separation of pads and wires is the most common problem of manual dip assembly.These familiar PCBA friends all know that the separation of pads and wires is the most common problem of manual dip assembly.
The reasons for this problem are as follows.
- The detachment of pads or wires during processing may be caused by electroplating solution, solvent etching or copper stress during electroplating operations.
- Punching, drilling or perforation will partly separate the pad, which will become obvious during the hole metallization operation.
- During wave soldering or manual soldering, the separation of the pad or wire is usually caused by improper soldering technology or excessive temperature. Sometimes the bonding of the laminate is not good or the thermal peel strength is not high, causing the pads or wires to separate.
- Sometimes the design and wiring of the printed board will cause the pads or wires to detach in the same place.
- During the soldering operation, the retained heat absorption of the component will cause the pad to detach.
Don’t worry if you encounter this kind of problem, and the following are the main solutions, they will definitely help you.
- Provide the laminate manufacturer with a complete list of solvents and solutions used.including processing time and temperature for each step. Analyze whether there was any copper stress and excessive thermal shock during electroplating.
- Be sure to observe the recommended processing methods. Frequent analysis of metallized holes can control this problem.
- The peeling of most of the pads or wires is caused by the lax requirements for all operators. If the temperature test of the solder bath fails or dwell time in the solder bath is increased.peeling occurs.
- In manual solder repair, brake pad peeling is likely caused by improper performance of electrical ferrochrome.and failure to conduct professional process training.
- Now some laminate manufacturers have made laminates with high peel strength at high temperatures for severe soldering applications.
I sincerely hope that this article of mine can help you better understand Manual dip assembly .and be able to quickly deal with the problems that arise in the process.
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