The schematic diagram of gerber bom, pictures are all available
Min. package 0201, min. BGA ball distance : 0.4mm
PCB Assembly size: Min. 50×50(mm), Max. 510x460mm
25 patents, more than 5 new applications per year Mainly research and develop products in the direction of Internet of Things, location tracking, smart wear, fresh air system, etc.
The erp system, under the conditions of the confidentiality agreement, can quickly find project files more than 10 years ago in our system, helping to promote your project progress and occupy the market
SMT MI (DIP) 4 batch production lines 4,000,000 points/day;2 small batch production lines 500,000 points/day
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Factory area
4800㎡
Countries
80+
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